Gallium Nitride (GaN) is a binary III/V direct bandgap semiconductor commonly used in light emitting diodes since the 1990s. The compound, GaN sputtering target, is a very hard material with a zincite crystal structure. GaN target's wide bandgap of 3.4 eV provides exceptional properties for applications in optoelectronic, high power and high frequency devices.
Purity: 99.99%
CAS: 25617-97-4
Size: Customer-made
GaN sputtering target has a low sensitivity to ionizing radiation (like other Group III nitrides), making it a suitable material for satellite solar cell arrays.
Military and space applications of GaN target may also benefit as equipment exhibits stability in radiation environments.
Chemical Formula: GaN
CAS Number: 25617-97-4
Purity: ≥99.99% (4N), available up to 5N upon request
Forms: Planar target (disc, rectangular), bonded target assemblies
Typical Densification: ≥95% of theoretical density
Manufacturing Process: Hot pressing / cold isostatic pressing + sintering
Backing Plate Options: Molybdenum (Mo), Copper (Cu), or custom alloys
Standard Sizes: 1", 2", 3", 4", 6" – custom sizes available
| Attribute | Technical Advantage |
High Density, Low Porosity | Reduces arcing, particle generation, and increases film uniformity. |
Excellent Thermal Stability | Critical for high-power, high-temperature deposition environments. |
High Purity | ≥99.99% reduces oxygen/carbon contamination—essential for optoelectronics and RF devices. |
Strong Bonding Options | Reliable indium bonding with excellent thermal conduction and mechanical strength. |
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