Hafnium nitride powder is a gray, cubic crystalline powder with a melting point of up to 3310 ℃ and a microhardness of up to 16GPa. Although it is quite stable, it is susceptible to corrosion from aqua regia, concentrated sulfuric acid, and hydrofluoric acid. Hafnium nitride powder has a wide range of applications in the electronics and aerospace fields. Its high electron mobility and high temperature resistance make it an ideal material for high-speed electronic devices and integrated circuits. Its excellent wear resistance, corrosion resistance, and high temperature performance make it the preferred material for aviation engine components. In addition, hafnium nitride powder has also been widely used in the fields of technology and decoration due to its high hardness, wear resistance, and oxidation resistance.
purity: 99.99% D90<3um
CAS: 25817-87-2
Product Name: Hafnium Nitride Powder
Chemical Formula: HfN
CAS Number: 25817-87-2
Purity: 99.5%, 99.9% (custom grades available)
Particle Size: 1–5 μm, nano-scale (<100 nm), or customized mesh
Appearance: Gray to dark gray crystalline powder
Crystal Structure: Face-Centered Cubic (FCC)
Melting Point: ~3310 °C
Thermal Conductivity: ~22 W/m·K
Packaging: Vacuum-sealed foil bags or inert-gas-filled containers
Property | Value to Engineers & Scientists |
Ultra-High Melting Point (~3310 °C) | Ideal for extreme thermal barrier coatings and UHTC components. |
High Hardness (~16–21 GPa) | Provides exceptional wear resistance in harsh environments. |
Excellent Chemical Inertness | Resists attack by molten metals and reactive gases—key for aerospace and foundry use. |
Good Electrical Conductivity | Enables use in microelectronics, diffusion barriers, and conductive ceramics. |
HfN powder is a critical material in demanding environments where high thermal, mechanical, and chemical performance is essential:
Thermal Barrier and Erosion-Resistant Coatings
Used in aerospace components, rocket nozzles, and turbine parts exposed to oxidizing and high-velocity flows.
Ultra-High Temperature Ceramics (UHTCs)
Combined with SiC or ZrB₂ to fabricate structural components capable of withstanding temperatures above 2000 °C.
Semiconductor & Microelectronic Devices
Functions as a diffusion barrier, hard mask, or conductive layer in CMOS, RF, or MEMS devices.
PVD Sputtering & Target Fabrication
Base material for producing HfN sputtering targets used in hard coatings, wear-resistant films, and microelectronic layers.
1. Purity Requirements
≥99.9% recommended for electronic and thin-film deposition use.
≥99.5% suitable for structural ceramics, refractories, and composite reinforcement.
2. Particle Size Distribution
Fine powder (<5 μm) supports better sinterability and coating uniformity.
Nano-scale hfn powder offers enhanced surface reactivity for specialized coatings or research.
3. Phase Stability & Crystal Structure
Zhiyue ensures stable FCC phase through optimized synthesis to maintain performance in high-temperature environments.
4. Storage and Packaging
HfN is stable in inert conditions but can gradually oxidize when exposed to moisture or air.
All batches are packaged in vacuum-sealed or argon-purged containers with full traceability.
Contact With Us:
E-mail: export@zhiyueltd.com
Have a Questions? Call Us:
Add:
RM.1624. Block A. Ming Feng Bo Ma Dou, Cross of Ming Guang Road and Shang Xin Road, Xi'an Economic and Technological Development Zone, Shaanxi Province, China