Xi'an Zhiyue Material Tech. Co., Ltd.
Xi'an Zhiyue Material Tech. Co., Ltd.

Titanium Carbide Powder (TiC)

Titanium carbide powder is a chemical material with unique properties, which has attracted attention for its high melting point, high hardness, excellent wear resistance, and chemical stability. This gray black powder not only has excellent physical properties, but also demonstrates extensive application value in multiple fields. In the aerospace field, titanium carbide powder can be used to manufacture high-performance lightweight structural components, improving the endurance and flight performance of aircraft. In the field of electronics, it can be used to manufacture electronic components with excellent conductivity, improving the stability and lifespan of equipment. In addition, titanium carbide powder can also be used as a high-quality raw material for metal ceramics and hard alloys, providing strong support for the development of materials science. In summary, titanium carbide powder has become an important research object in today's industrial and scientific fields due to its excellent performance and broad application prospects.


Purity: ≥ 99.99% 

Particle size: D90 < 3um

CAS: 12070-08-5

  • titanium carbide powder
  • titanium carbide powder

Advantages of Titanium Carbide Powder (TiC Powder)

  • Exceptional Hardness and Wear Resistance
    TiC is widely used in carbide coating materials due to its superior hardness and durability, making it ideal for cutting tools and wear-resistant surfaces

  • High Thermal Stability for Extreme Environments
    Titanium carbide maintains structural integrity at high temperatures, suitable for aerospace and high-temperature coating applications.

  • Low Friction and Chemical Inertness
    TiC coatings provide reduced friction and strong corrosion resistance, improving component lifespan in harsh environments

  • Ideal for Thin Film Deposition and PVD Applications
    As a key sputtering target material precursor, TiC powder supports high-performance thin film coating and semiconductor processes.

  • Controlled Particle Size Distribution
    Available in nano to micron sizes, ensuring flexibility for different applications such as sintering, coating, and additive manufacturing.


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