Terbium sputtering targets are made from terbium metal. It is a silvery-white rare earth metal that is ductile, tough and flexible enough to be cut with a knife. It is relatively stable in air. Density 8.23 g/cm3, melting point 2473 °C, boiling point: 3123 °C. It is suitable for industrial grade coatings, experimental or research grade terbium targets, electronics, optoelectronics, military, decorative and functional films.
Purity: 99.95%
CAS: 7440-27-9
High performance terbium sputtering material can be used for thin film coating, CD-ROM, decoration, flat panel display, functional coating, as well as other optical information storage space industries, glass coating industries such as automotive glass and architectural glass, optical communication, etc.
Product Name: Terbium Sputtering Target
Chemical Symbol: Tb
CAS Number: 7440-27-9
Purity Grades: 99.9%, 99.99% (3N, 4N)
Available Forms: Planar targets (disc, square, rectangular), rotary targets, bonded assemblies
Manufacturing Process: Vacuum melting + hot pressing / HIP sintering
Standard Sizes: 1–6 inch diameter; thicknesses from 2 mm to 12 mm (custom available)
Backing Plate Materials: Copper (Cu), Molybdenum (Mo), Stainless Steel (SS)
Packaging: Argon-filled or vacuum-sealed to prevent oxidation
| Feature | Customer Value |
High Purity (Up to 99.99%) | Minimizes contamination and ensures film integrity in electronic and optical applications. |
Precision Bonding & Machining | Strong adhesion to backing plates ensures thermal management and sputter uniformity. |
Low Oxygen and Carbon Content | Reduces defects during deposition—critical for semiconductor and optical film quality. |
Custom Geometries Available | Designed to fit your deposition system: magnetron sputtering, RF/DC sputtering, ion beam, and others. |
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